Flip-Chip is a microelectronics assembly process for contacting semiconductors using bumps. The advantages of using Flip-Chip include its high component density and the short conductor lengths. Here, the chip is laid head first on the substrate, i.e. with the active contact side down. The following variants are available for attaching the Flip-Chip and connecting all the contacts:

• Reflow soldering with subsequent sticking using an underfiller, which capillates between the chip and the substrate
• Conductive adhesive with isotropic conductive adhesive and ensuing sticking using an underfiller
• Conductive adhesive with anisotropic conductive adhesive (in this case without underfiller)
• Sticking with no-flow underfiller and contact via stud bumps or solder or conductive adhesive