Chip-On-board (COB) technology involves mounting DRAM or Flash semiconductor dies directly on a substrate and connect them by bond wires to the PCB without the need of packaged component. A coating of an Epoxy encapsulent (or Glob Top) is then applied that hermetically seals and protects the die and the wire bonded interconnections. The Glob Top also acts like a heat spreader between the dies and improves the heat emission together with the low thermal resistance between the die and the PCB. A COB memory module as offered by Swissbit provides customers with the following advantages:
The COB process allows DRAM modules with only 1.00” (25.4 mm) height and 3.0 mm thickness
The thermal properties of Swissbit modules are superior to standard SMT modules. COB modules dissipate heat more efficiently and will run lower die junction temperatures in demanding convective cooling conditions.
Swissbit COB modules and Flash products like the SD card are inherently ruggedized for shock and vibration due to the COB technology and the Glob Top encapsulation process.