Chip-On-board (COB) technology involves mounting DRAM or Flash semiconductor dies directly on a substrate and connect them by bond wires to the PCB without the need of packaged component. A coating of an Epoxy encapsulent (or Glob Top) is then applied that hermetically seals and protects the die and the wire bonded interconnections. The Glob Top also acts like a heat spreader between the dies and improves the heat emission together with the low thermal resistance between the die and the PCB. A COB memory module as offered by Swissbit provides customers with the following advantages:

• The COB process allows DRAM modules with only 1.00” (25.4 mm) height and 3.0 mm thickness
• The thermal properties of Swissbit modules are superior to standard SMT modules. COB modules dissipate heat more efficiently and will run lower die junction temperatures in demanding convective cooling conditions.
• Swissbit COB modules and Flash products like the SD card are inherently ruggedized for shock and vibration due to the COB technology and the Glob Top encapsulation process.